RRP Electronics and Deca Technologies Forge Strategic Partnership to Elevate India’s Semiconductor Industry

 

Mumbai: In a transformative move for India's semiconductor sector, "RRP Electronics", backed by cricketing icon Sachin Tendulkar, has announced a strategic alliance with US-based "Deca Technologies Inc." to enhance its wafer-level packaging capabilities. This partnership represents a crucial milestone in India’s ambition to become a global semiconductor leader.

Under this collaboration, 'RRP Electronics', known for its expertise in semiconductor assembly and testing, will integrate Deca's advanced Wafer-Level Chip Scale Packaging (WLCSP) and M-Series™️ Fan-Out Wafer-Level Packaging (FOWLP) technologies into its operations. This integration will empower 'RRP Electronics' to deliver high-performance semiconductor solutions for global markets.

'Deca Technologies', a pioneer in advanced semiconductor packaging, supported by Qualcomm, Infineon, and ASE Group, sees this alliance as a key opportunity to enter India’s booming electronics and semiconductor ecosystem.

Already making waves in the industry, 'RRP Electronics' is currently engaged in a high-profile project for a Swiss client, producing Application-Specific Integrated Circuits (ASICs) in QFN packages. This further establishes its reputation for precision engineering and innovation in the electronics sector.

Rajendra K. Chodankar, Chairman & CEO of RRP Electronics, expressed his optimism about the collaboration, stating: “We are investing in a large-scale Technology Transfer License Agreement (TTLA) with Deca, potentially on exclusive terms, to build a fully automated, world class infrastructure. This partnership will propel semiconductor packaging in India to new heights. We anticipate completing our qualification tests by August 2025 and foresee revenues exceeding USD 30 million (₹260 crore) in the second year of operations, with exponential growth ahead.”

Tim Olson, Founder & CEO of Deca Technologies, echoed this enthusiasm: “We are excited to be part of India’s ambitious semiconductor growth story. RRP Electronics’ vision, expertise, and dedication make it an ideal partner to drive innovation in semiconductor packaging. This collaboration will accelerate their ambitious plans and solidify India’s position in the global semiconductor value chain.”

Beyond this collaboration, 'RRP Electronics' is spearheading a massive ₹12,035 crore Phase 1 Outsourced Semiconductor Assembly and Test (OSAT) initiative and a ₹24,000 crore semiconductor fabrication (fab) facility in Maharashtra. This project, supported by the Government of Maharashtra, aims to foster economic growth and technological advancement in the region.

In September 2024, 'RRP Electronics' inaugurated a state-of-the-art manufacturing facility equipped with next-generation technology. This initiative is expected to create around 4,000 jobs, boosting the local economy and positioning Maharashtra as a global semiconductor hub.

As India accelerates its semiconductor ambitions, the collaboration between 'RRP Electronics' and 'Deca Technologies' is set to redefine the industry landscape. This partnership will bring cutting-edge packaging solutions, significant job creation, and a new era of technological leadership to India’s semiconductor ecosystem.